3M™ UV-Curable Adhesive LC-3200

  • 3M Product Number LC-3200
  • 3M ID B5005035148

UV-Curable Adhesives enable fast curing and high thru put while helping to eliminate solvents and waste

100% solid acrylic adhesives

Compatible with typical semiconductor process chemistries and processes

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Details

Highlights
  • UV-Curable Adhesives enable fast curing and high thru put while helping to eliminate solvents and waste
  • 100% solid acrylic adhesives
  • Compatible with typical semiconductor process chemistries and processes
  • Compatible with the 3M™ Wafer Support System
  • Compatible with typical semiconductor process chemistries and processes
  • Used as part of the 3M™ Wafer Support System

3M™ UV-Curable Adhesive LC-3200 is a 100% solids UV curable acrylic adhesive. 3M adhesive LC-3200 is suitable for temporary wafer bonding of silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System.

The versatile heart of the temporary bonding and debonding process

  • Graphic of temporary bonding and debonding process
  • A. Semiconductor wafer
    B. 3M™ UV-Curable Adhesive LC-3200 (this product)
    C. 3M™ Light-To-Heat Conversion Release Coating (LTHC Ink)
    D. Glass carrier

    3M™ Liquid UV-Curable Adhesive LC-3200 is applied between the semiconductor wafer and the customer-supplied support glass carrier. Rubber based adhesive cures under UV light. It laminates to the wafer and, when used with 3M™ Light-to-Heat-Conversion Release Coating, bonds firmly but temporarily to the glass carrier. It debonds cleanly via laser irradiation, preserving the integrity of the glass carrier for reuse and recycling.

Specifications

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.