3M™ CMP Pad Conditioner Brush

Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads

Easy connection to polishing tool end effector

Exclusive polymer substrate enhances corrosion resistance

Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads
Easy connection to polishing tool end effector
Exclusive polymer substrate enhances corrosion resistance
Efficient pad cleaning and slurry distribution helps enable low cost of ownership
3M™ CMP brush connects easily to polishing tool end effector
Designed for semiconductor grade CMP processes

Engineered CMP pad conditioner brushes are designed for critical semiconductor buff CMP applications.

Excellent for use with soft CMP pads

Strong, durable bristles are independently anchored and evenly distributed across the 3M brush surface, making the 3M brush ideal for removing pad debris from soft microreplicated, porometric and felt-based CMP pads. Bristles are made from an exclusive polymer that resists corrosion much better than metal. The polycarbonate carrier features a universal mounting configuration, making for easy connection to a wide range of polishing tools and effectors.

	Current product 3M™ CMP Pad Conditioner Brush	3M™ Diamond Pad Conditioner	3M™ Trizact™ Pad Conditioner
Applications	Advanced Node (Memory & Logic), CMP, Pad Cleaning, Wafer Manufacturing
Brands	3M™

Excellent for use with soft CMP pads