3M™ Trizact™ Pad Conditioner
- 3M ID B5005049057
Details
Highlights
- Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
- Accurately controlled microreplicated structures
- Consistent performance disk-to-disk and the metal-free cutting surface
- Ideal for advanced node processes sensitive to metallic contamination
Bringing together 3M’s know-how in abrasives, ceramics and microreplication, the 3M™ Trizact™ Pad Conditioner is an innovative pad conditioner for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.
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Microreplication – when consistency and precision really matter
Featuring precisely-shaped, three-dimensional abrasive structures, 3M™ Trizact™ CMP pad conditioners are ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication – a core 3M technology applied to advanced node semiconductor manufacturing – these structures are reproduced uniformly across the Trizact™ CMP pad conditioner surface. What’s more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.
Specifications
Related Products
| Applications | Advanced Node (Memory & Logic), CMP, Wafer Manufacturing |
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