3M™ Diamond Pad Conditioner C Series

3M Product Number C Series
3M ID B5005469001

Optimized diamond shape, pitch control and diamond orientation

Improved consistency and reduced disk-to-disk variation

Slower pad wear rate decay with stable removal rate and profile

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Highlights

Optimized diamond shape, pitch control and diamond orientation
Improved consistency and reduced disk-to-disk variation
Slower pad wear rate decay with stable removal rate and profile
Enables potential for longer disk life and pad life
Uses 3M sintered abrasive technology for firm diamond adhesion
40% improvement in flatness control over legacy designs

3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioner C Series. It also minimizes wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.